EQUIPMENT SERIES
Crystalline-silicon slicing diamond wire
DIASC / Sanchao ↗Fine electroplated diamond wire for cutting crystalline silicon into wafers, made on tungsten or carbon-steel cores. Sanchao lists every finished diameter next to its matching core size.
Sizes come from Sanchao's slicing-wire table. Sanchao's 2025 annual report says it now makes less PV fine wire and picks which orders to take, which limits what you can buy today.
General illustration of wafer processing equipment, not a photograph of this model. Ask the manufacturer for current photographs and layout drawings of the configuration offered.
START WITH YOUR PRODUCTION TASK
Pick the core and finished size that suits your saw and wafer, ask Sanchao to confirm in writing that the grade is available, then judge it on wafer geometry, damage and usable yield over a representative spool.
SOURCE-LINKED DATA
Published specifications
Values below are published by the manufacturer, each with the date its source was checked. Ask for the figures that apply to your configuration and material in the quotation.
The manufacturer has not published a complete specification table for this entry. Request the exact offered drawing and operating limits.
01 · Manufacturer information
Tungsten and carbon-steel wire sizes
On tungsten cores of 29, 31, 33 and 35 μm, Sanchao builds wire finishing at 41, 43, 45 and 47 μm. The carbon-steel range is wider, with six sizes finishing at 47, 49, 51, 54, 57 or 59 μm over cores that step from 35 up to 45 μm. Quote the core and finished value as a pair. The table gives no grit protrusion or kerf width, so measure kerf during your trial.
Every grade uses 6–12 μm diamond grain and is sold up to 240 km long. Finished tolerance is ±2 μm on the tungsten wire and on carbon-steel wire up to 51 μm, widening to ±3 μm from 54 μm. Your enquiry should ask for breaking load, working tension and wire speed, how well the coating holds, spool format and target wafer thickness, since the page omits them.
Source: DIASC silicon slicing wire page
02 · Manufacturer information
Slicing wire size table
| Core type | Finished diameter μm | Core diameter μm | Finished tolerance μm |
|---|---|---|---|
| Tungsten | 41 / 43 / 45 / 47 | 29 / 31 / 33 / 35 | −2 to +2 |
| Carbon steel | 47 / 49 / 51 | 35 / 37 / 39 | −2 to +2 |
| Carbon steel | 54 / 57 / 59 | 41 / 43 / 45 | −3 to +3 |
Source: DIASC silicon slicing wire page
03 · Manufacturer information
Fine-wire supply after the 2025 cutback
Sanchao's 2025 annual report describes a shrinking PV slicing-wire business that accepts orders selectively. The report names no single diameter as stocked or dropped. Ask for the grades and diameters on offer, the company that will make them, batch traceability and the delivery scope before you book saw time for a trial.
Source: Sanchao 2025 annual report
04 · PVYard procurement analysis
What to send with a slicing-wire enquiry
Saw and ingot
Machine model, wire path and spool fittings, ingot size and condition, and the wafer thickness and tolerance you need.
Wire grade
Core and finished diameter chosen separately, plus a request for mechanical, coating, grain distribution and spool length data.
Wafer checks
Thickness spread, bow and warp, surface damage, breakage and usable wafer count, each with its sampling method.
Wire use
How the trial counts wire consumed, changes, stoppages and scrap, run under saw settings Sanchao approves.
Source: DIASC silicon slicing wire page
05 · PVYard procurement analysis
Running a wafer trial
Fix grade and lot
Lock the specification, the supplier lot and spool fit with your saw.
Cut normal production ingots
Use the agreed incoming silicon with controlled saw and coolant settings set by your process team and Sanchao.
Sample across the cut
Measure the agreed geometry, surface and damage at several points in the cut and at several stages of wire life, and log every reject.
Sign off supply
Report usable wafers, kerf and material loss, wire used and breaks, and keep batch and recovery records.
Source: DIASC silicon slicing wire page
06 · PVYard procurement analysis
Slicing-wire questions
Is 29 μm a finished wire size?
No. It is the smallest tungsten core; the wire built on it measures 41 μm finished.
Will every spool be 240 km long?
240 km is the longest length listed. Agree spool length and format in the order.
Can I order every diameter in the table?
Ask first. The 2025 report describes a smaller, selective PV fine-wire business.
Source: DIASC silicon slicing wire page
TURN THIS INTO A CLEAR REQUEST
Ask about this product
Include the product-specific questions above and replace every bracket with your actual requirement. Save your edited text to your sourcing brief, then review it before submitting an enquiry. Saving a brief does not send it to a manufacturer.
Sources
Manufacturer information and our buying guidance are labelled section by section above. Each source below shows the date it was checked.
DIASC silicon slicing wire page ↗
Source check: 2026-10-11 · Product page with the paired core and finished diameter table and an application photo.
Sanchao 2025 annual report ↗
Source check: 2026-10-11 · Pages 12, 16 and 23: smaller PV fine-wire business, and Sanxin's equipment work paused with no restart plan at the report date.
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