EQUIPMENT SERIES
Silicon cropping and squaring diamond wire
DIASC / Sanchao ↗Diamond wire for the stock-preparation cuts on silicon: cropping and squaring monocrystalline ingots and cutting multicrystalline blocks into bricks. It is several times thicker than Sanchao's wafer-slicing wire.
Sizes come from Sanchao's cropping and squaring table, where some cells span several rows. Length tops out at 30 km here, against 240 km for the slicing wire.
General illustration of wafer processing equipment, not a photograph of this model. Ask the manufacturer for current photographs and layout drawings of the configuration offered.
START WITH YOUR PRODUCTION TASK
Agree the ingot and the crop or square geometry you keep, choose the matching finished, core and grain row, then trial it on dimensions, damage, cut loss and wire use.
SOURCE-LINKED DATA
Published specifications
Values below are published by the manufacturer, each with the date its source was checked. Ask for the figures that apply to your configuration and material in the quotation.
The manufacturer has not published a complete specification table for this entry. Request the exact offered drawing and operating limits.
01 · Manufacturer information
Where cropping and squaring wire fits
Sanchao's diagram puts this wire ahead of slicing and polishing: cropping and squaring monocrystalline ingots, and bricking multicrystalline ones. The table runs from 290 to 460 μm finished diameter on cores from 220 to 350 μm. Grain and tolerance change from row to row, and the 320 and 340 μm sizes carry an uneven −10 to +20 μm band. Order these sizes on their own line, apart from any wafer-slicing wire.
One 30 km maximum length covers the whole table. The page is silent on core material, breaking strength, tension and speed limits, coating durability and the block geometry you can expect. A thicker wire still has force, kerf and surface damage limits on your saw. Ask Sanchao to define a saw-matched grade with those limits before you compare price per kilometre.
02 · Manufacturer information
Cropping and squaring wire sizes
| Finished μm | Core μm | Tolerance μm | Diamond grain μm |
|---|---|---|---|
| 290 | 220 | −10 to +10 | 30–40 |
| 320 | 250 | −10 to +20 | 30–40 |
| 340 | 250 | −10 to +20 | 35–45 |
| 360 | 280 | −20 to +20 | 35–45 |
| 390 | 300 | −20 to +20 | 40–50 |
| 460 | 350 | −20 to +20 | 45–55 |
03 · PVYard procurement analysis
What Sanchao needs to quote cropping wire
Cut map
Mono or multi stock, incoming size, crop and sample positions, square orientation and cross-section, and which pieces you keep or scrap.
Saw details
Saw model, wire path and spools, coolant and filtration, and handling. Ask for mechanical and coating data and the lot you would receive.
Acceptance checks
Face geometry, block dimensions, surface and subsurface damage, material loss and what the next process will accept, each with an agreed method.
04 · PVYard procurement analysis
Trial cropping wire on real ingots
Fix row and material
Approve the exact table row, the grain, core and coating details and the incoming ingots.
Cut with approved settings
Run Sanchao-approved saw settings on your actual fixtures and supports.
Measure the kept blocks
Check the agreed crop and square dimensions, geometry and damage at several positions and at early and late wire life.
Count real output
Put cut loss, rejects, wire breaks and changes, handling and full cycle time into the cost per accepted block.
05 · PVYard procurement analysis
Cropping-wire questions
Is every tolerance band even?
No. The 320 and 340 μm sizes use −10 to +20 μm.
Is the maximum length the same as slicing wire?
No. This table gives 30 km; the 240 km figure belongs to the slicing wire.
Will the cut be as wide as the finished diameter?
The page gives no kerf figure or method. Measure cut width in your trial.
TURN THIS INTO A CLEAR REQUEST
Ask about this product
Include the product-specific questions above and replace every bracket with your actual requirement. Save your edited text to your sourcing brief, then review it before submitting an enquiry. Saving a brief does not send it to a manufacturer.
Sources
Manufacturer information and our buying guidance are labelled section by section above. Each source below shows the date it was checked.
DIASC cropping and squaring wire page ↗
Source check: 2026-10-11 · Six size rows with merged cells and a diagram of where the wire sits in ingot preparation.
Compare equipment for a related task
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