PV MANUFACTURING EQUIPMENT
Find machinery by production stage and the requirements of your line.
Diamond wire does two jobs in wafer processing. Thicker wire crops ingots from crystal growth furnaces and squares them into bricks, which then move to silicon ingot grinding with wheels from silicon grinding consumables. Fine wire slices bricks into wafers on wire saws, such as the crystal wafer slicing equipment from Zhejiang Jingsheng, with coolant from silicon cutting fluids. After slicing, wafers are cleaned and sorted, often with automation such as a wafer slicing factory automation system and other wafer handling equipment.
Sanchao (DIASC) covers both jobs: a fine electroplated slicing wire on tungsten or carbon-steel cores, and a much thicker cropping and squaring wire for ingots and bricks. Zhejiang Tony Electronic offers steel-core and tungsten-core diamond wire with its size ranges given for the core. Chant Tech supplies tungsten wire to the cutting supply chain; ask whether you are buying finished diamond wire or the tungsten core that a wire maker then plates, because those are different purchases.
Core material shifts the trade-off: tungsten cores allow thinner wire and less kerf loss, while steel cores remain a common choice where cost per cut leads. Compare finished diameter rather than core size, and ask for breaking load, grit size distribution and how evenly the diamond sits along the wire. Results also depend on the saw: tension, wire speed, guide-roll groove pitch and coolant all change the outcome, so trial each wire on your own saw with your own coolant.
Measure wafer thickness variation, saw marks, edge chipping and breakage at later stages, along with wire used per cut and cut time. The guide to comparing breakage, cycle time and throughput helps you set those measures on a common basis. Run more than one spool, record lot numbers, and keep spool format and winding quality in the comparison, since a poorly wound spool can snap a wire mid-cut.
Identify the production step, cell or module format and output unit before comparing equipment. Use the listed source, scope and specifications to prepare a configuration-specific enquiry. Missing values are left unspecified and do not count as exact filter matches.
Heavier DIASC electroplated diamond wire for cropping and squaring silicon ingots before wafering. Six sizes run from 290 μm finished on a 220 μm core to 460 μm on a 350 μm core, with 30–40 to 45–55 μm grain and a 30 km maximum length. Send your ingot cut map so Sanchao can quote the right row.
DIASC / SanchaoDIASC electroplated diamond wire for slicing crystalline-silicon wafers. Tungsten-core grades run 41–47 μm finished on 29–35 μm cores; carbon-steel grades run 47–59 μm on 35–45 μm cores. All carry 6–12 μm grain in lengths up to 240 km. Sanchao's 2025 report says PV fine-wire output was cut back, so ask which diameters it can ship before planning a trial.
DIASC / SanchaoTony's diamond cutting wire carries 5–8 μm diamond particles on a carbon-steel core of 36–42 μm or a tungsten core of 24–28 μm. It runs on a slicing machine to cut mono- and multicrystalline silicon wafers. Order it as coated finished wire, name the exact core size, and ask for spool, length and lot documents to come with the sample.
Zhejiang Tony Electronic Co., Ltd.A Chant Tech tungsten wire, supplied on a spool, for the chain that slices PV silicon wafers. The catalogue entry carries no grade figures, and the company also makes tungsten diamond wire. Ask which of the two you are being offered, then request diameter, coating and spool details for that grade.
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