PV MANUFACTURING EQUIPMENT
Find machinery by production stage and the requirements of your line.
The name covers more than wafer slicing. An ingot from a crystal growth furnace is first cropped to remove head and tail, then squared into a bar, often finished on ingot grinding equipment, and only then sliced. Cut wafers go on to cleaning and wafer handling, all within wafer processing. Every step consumes cutting wire, such as DIASC's cropping and squaring diamond wire and slicing diamond wire, plus coolant from silicon cutting fluids.
Crystal wafer slicing equipment from Zhejiang Jingsheng Mechanical & Electrical handles PV silicon, semiconductor silicon and sapphire, each machine set up for its own material and size window. Start from your ingot and the wafer quality your cell line needs.
The remaining machines come from TDG NISSIN. For cropping, the NWSS-DH02 uses one wire for low volumes and sample slices, the NWSS-840 makes seven cuts for six segments with adjustable length, and the NWSS-210 crops three long ingots side by side. For squaring, the NWSS-DD700Z takes one segment per cut, the NWSS-DS700Z runs two stations, and the NWSS-JK4700 combines cropping and squaring on one frame.
Double-end croppers range from the NWSS-6S at six blocks to the NWSS-7S at seven. The NWSS-812 cuts one end of twelve blocks, the NWSS-250 and 250A family takes 25 blocks and the NWSS-360 takes 36 or 48. Batch squarers come at G6 with slurry wire in the NWSS-125M(K) or diamond wire in the NWSS-125H, and at G5 in the NWSS-125G.
Sort first by stock form, round mono ingot or cast poly block, then by batch size, then by wire type. Compare total material loss and accepted batch time with the fixture and wire recipe held fixed, counting loading, table rotation and offcut removal. To put batch claims on one basis, use the guide to breakage, cycle time and throughput claims, and utilities and installation requirements covers cooling, power and floor loading. Get the chosen configuration and trial results written into the offer from TDG NISSIN or Jingsheng, and run acceptance as the FAT and SAT guide sets out.
For pv wafer slicing equipment, begin your enquiry with ingot material and dimensions, target wafer thickness and cutting method. Request a configuration-specific quotation and agree on wire specification, kerf measurement, breakage criteria and downstream cleaning. Each listing shows the published values and the questions to confirm.
The TDG NISSIN NWSS-840 crops long monocrystalline ingots into six segments with seven cuts, and can also take head, tail and sample slices. It accepts ingots 1800–4000 mm long and sets cut lengths from 300 to 700 mm, with automatic centring and length changes that leave the wire intact. The sheet lists 8 or 9 inch diameters, while one catalogue summary says 8–12 inch.
TDG NISSINThe TDG NISSIN NWSS-812 crops one end, head or tail, of twelve polycrystalline blocks per cut. It takes 156 × 156 mm blocks 200 to 400 mm long and runs thicker 0.37–0.42 mm coated wire at up to 1200 m/min from a 7 km spool. Two rotating tables let operators load one side while the other cuts. Plan a second pass if you need both ends cropped.
TDG NISSINThe TDG NISSIN NWSS-360 is a diamond multiwire cropper for large polysilicon batches. Its page text names two loads: 36 blocks 400 mm long or 48 blocks 300 mm long. The data sheet covers the 36-block load at 156 × 156 × 400 mm, with 40 kW power and 320 L/min cooling water. For the 48-block load, request a fixture and figures of its own.
TDG NISSINTDG NISSIN's NWSS-250 and NWSS-250A are diamond-wire croppers that take the head and tail off 25 polycrystalline blocks in one load. One data sheet lists both: 156 × 156 × 300 mm stock, 0.31–0.33 mm coated wire, 900 m/min. The 250A has a shorter 350 mm lift, draws 35 kW against 27 kW and needs more floor space. The product page text says 400 mm blocks, so settle block length when you ask for a quote.
TDG NISSINThe NWSS-125G is the smaller G5 diamond-wire squarer in the TDG NISSIN range. It squares 25 mono ingots of 6 or 6.5 inch or 16 of 8 or 8.5 inch, or cuts an 840 × 840 × 500 mm poly block into 25 columns. Wire speed reaches 720 m/min, power is 85 kW and the frame is 3550 mm long.
TDG NISSINNWSS-125H is the TDG NISSIN G6 squarer for fixed-abrasive diamond wire. Its mono fixtures carry 36 ingots at 6 or 6.5 inch, or 25 at 8 or 8.5 inch, or cuts a 1000 × 1000 × 500 mm poly block into 36 columns of 156 × 156 × 500 mm. Coated wire of 0.31–0.33 mm runs at up to 900 m/min, and the machine is rated 90 kW.
TDG NISSINTDG NISSIN's NWSS-125M(K) squares a G6 load with slurry-assisted multiwire cutting. One fixture takes 36 mono ingots of 6 or 6.5 inch, another takes 25 of 8 or 8.5 inch, and a poly setup turns a 1000 × 1000 × 450 mm block into 36 pieces measuring 156 × 156 × 450 mm. Listed machine power is 100 kW.
TDG NISSINThe NWSS-JK4700 crops and squares monocrystalline silicon on one machine, and TDG NISSIN says both jobs can run at the same time. It takes one 4 m ingot of 8–9 inch diameter and works segments 150–700 mm long. It suits plants that want to merge two ingot steps into one footprint. Ask for a timing chart and material-route drawing with the quote.
TDG NISSINThe NWSS-DD700Z squares one monocrystalline ingot segment at a time with diamond wire. TDG NISSIN lists 150–700 mm segments in 200–250 mm diameter. Loading and unloading grippers come with the machine; edge detection and automatic centring are options. It suits smaller squaring cells. Specify your square drawing and which options you want when asking for a price.
TDG NISSINThe NWSS-210 crops three monocrystalline ingots at the same time using diamond multiwire across six cutting heads. TDG NISSIN lists 2.2 m ingots in 6, 6.5, 8 or 8.5 inch diameters and a thin 0.31–0.33 mm coated wire. It fits plants that cut full-length ingots into segments in one pass. Send your cut map for each ingot when you ask for a quote, and check the 400 L/min cooling demand.
TDG NISSINThe NWSS-6S is TDG NISSIN's six-block cropper for polycrystalline silicon. It trims the head and tail of six 156 × 156 mm blocks with diamond multiwire, taking 220–400 mm incoming blocks down to 160–330 mm. Two rotating tables let the next batch be loaded while the current one cuts. It suits plants running shorter blocks than the seven-block NWSS-7S handles. Quote it with your block drawing and the finished length you need.
TDG NISSINThe TDG NISSIN NWSS-DH02 is a compact single-wire diamond machine for cropping monocrystalline ingots and cutting sample slices, with finished lengths of 100–700 mm, 12 kW power and a 2000 kg frame. Its text gives 8–12 inch stock over four metres long, while its table gives one 6–8.5 inch, four-metre ingot, so settle the size range first.
TDG NISSINExact filters only match published specifications. Listings without that published value are not shown.
A wafer-slicing purchase links the incoming workpiece to the required wafer and the subsequent cleaning process. The useful comparison is not simply machine speed: it includes material, ingot geometry, wire arrangement, recoverable wafer output and the conditions under which quality is measured.
Request a capacity calculation tied to the proposed workpiece and cutting recipe. Compare saleable output, wire consumption and the agreed breakage definition on identical samples. Separate cutting time from loading, changeover and planned maintenance.
Agree a representative cutting run and a sampling plan for thickness, surface condition and breakage. Record the wire configuration, workpiece batch and measurement procedure. Establish which consumables and sample preparation steps are included in the trial.
Inch ranges in a catalogue identify a processing family. Ask which combinations are offered and what rate applies to your ingot.
Procurement guidance by PVYard Editorial, updated 2026-10-07. Turn the requirements into a sourcing brief →