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Silicon ingot grinding

Find machinery by production stage and the requirements of your line.

Selection considerations

Where grinding sits in wafer processing

Ingots leave the crystal growth furnace, are cropped and then squared on machines from the wire saws class, for example the single-ingot monocrystalline squarer, the two-station ingot squarer, the combined cropping and squaring machine or the diamond-wire batch squarer. A squared bar still carries saw marks and sharp edges. Grinding flattens the faces and rounds or chamfers the corners, which reduces edge chipping once the bar is sliced. Slicing follows on equipment such as Jingsheng's crystal wafer slicing equipment with cutting wire, and the wafers then go to cleaning. All of this belongs to wafer processing.

The listed machine

The NVG-7500 silicon ingot face grinding and rounding centre from TDG NISSIN is a vertical centre that grinds the faces and rounds or chamfers the edges of mono ingots and poly blocks. Rotary stations let one piece load while another is ground. It suits a plant that wants face and edge finishing in a single machine instead of two.

Because the same maker builds the squarers above, you can ask for the squared bar size and the grinding allowance to be agreed together, so neither machine removes more silicon than needed.

Wheels and running cost

Grinding wheels come from silicon grinding consumables, among them DIASC's solar silicon face-grinding wheels (DIASC / Sanchao). The wheel package decides finish, cycle and replacement interval, so run the acceptance trial with the wheels you will actually buy and record wheel wear per piece.

Writing the offer

Send your incoming bar size and the final face and chamfer drawing. Then have TDG NISSIN state the model revision, the length limit, the wheel package and the accepted trial finish in the written offer. Measure face flatness, chamfer geometry and surface condition on trial pieces, and slice a few to see whether edge chipping drops compared with unground bars. Comparing breakage and cycle-time figures frames that test, equipment trials, FAT and SAT covers the acceptance steps, and utilities and installation requirements lists the coolant, power and foundation details to settle before delivery.

Plan the equipment scope

Identify the production step, cell or module format and output unit before comparing equipment. Use the listed source, scope and specifications to prepare a configuration-specific enquiry. Missing values are left unspecified and do not count as exact filter matches.

Read equipment buying guides or prepare a sourcing brief.

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Silicon ingot face grinding and rounding centre

The NVG-7500 is a TDG NISSIN vertical centre that grinds the flat faces and rounds or chamfers the corners of mono ingots and poly blocks after squaring. It takes 156–160 mm sides or 8–10 inch diameters, spins wheels up to 3000 rpm and draws 45 kW. Ask which model revision and length limit the quotation covers.

TDG NISSIN
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