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EQUIPMENT DIRECTORY

Silicon cutting fluids

Find machinery by production stage and the requirements of your line.

Selection considerations

What the coolant does

In diamond-wire sawing, a water-based fluid cools the wire and the cut, lubricates the contact and carries silicon fines out of the kerf. The fluid listed here, silicon cutting coolant from DIASC / Sanchao, is a water-soluble synthetic used when sawing silicon wafers and polysilicon. Slurry cutting works differently, with loose abrasive in a carrier, which is why TDG NISSIN's slurry-wire batch squarer and its diamond-wire batch squarer from the same maker come with different consumable packages. This class sits within wafer processing.

Where the fluid is used

Coolant runs on every machine in the wire saws class: slicing on crystal wafer slicing equipment from Zhejiang Jingsheng, and cropping or squaring on multiwire machines such as the three-ingot monocrystalline cropper, whose buyers are told to confirm the real cooling supply. Fluid and wire work as a pair. DIASC also sells cutting wire, including slicing diamond wire and cropping and squaring wire, so you can ask whether a matched wire and fluid recipe is available. If you also run face grinding with silicon grinding consumables, ask whether the same fluid suits that step or a separate one is needed.

Planning the trial

Get the current SDS and technical sheet for the exact grade, then check them against your make-up water, the materials in your pumps, tanks and seals, and your effluent route. Mix the fluid at the concentration Sanchao recommends and keep that concentration logged through the trial.

Judge the fluid on the whole process, not on the cut alone. Track wafer surface and breakage, how the fluid circulates and filters as fines build up, foaming, and how much fresh fluid the saw consumes. Residue left on the wafers lands in the cleaning step, so ask the cleaning team to check trial wafers too. Count breakage on a fair basis with the breakage and throughput guide, and utilities and installation requirements covers water supply, circulation and drainage. Run the trial with Sanchao's guidance and keep the grade, batch and settings recorded alongside the results.

Plan the equipment scope

Identify the production step, cell or module format and output unit before comparing equipment. Use the listed source, scope and specifications to prepare a configuration-specific enquiry. Missing values are left unspecified and do not count as exact filter matches.

Read equipment buying guides or prepare a sourcing brief.

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Silicon cutting coolant

DIASC water-soluble synthetic coolant for diamond-wire cutting of silicon wafers, polysilicon and other hard, brittle materials. Sanchao gives a one-to-twenty mix with water, a pH band of 8.0–9.2, surface tension of 30 dyn/cm or less, a two-year shelf life and 25 kg or 200 kg packs. Request the SDS and technical sheet for your grade with the quote.

DIASC / Sanchao
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