Find machinery by production stage and the requirements of your line.
Selection considerations
Where deposition sits in a cell line
Deposition tools add the thin films that passivate the wafer surface, form passivating contacts or carry current to the electrodes. On the cell production route, wafers usually arrive from texturing and diffusion furnaces, sometimes after laser doping, and leave for metallization equipment. Tube tools also depend on carriers: graphite boats from process graphite parts and tubes from process quartz parts wear with every run, so price them into the running cost. Which films you need follows from your cell route; our cell technology compatibility notes help map TOPCon, HJT, back-contact or perovskite stacks to tool types.
Tube furnaces for passivating contacts
Several tube offers cover the oxide and polysilicon layers of contact routes. The PERTOP tube PECVD solution from Yingkou Jinchen Machinery grows silicon oxide and in-situ doped amorphous silicon. The tube plasma polysilicon furnace from S.C New Energy runs tunnel oxide, intrinsic and doped polysilicon in one tube. From NAURA, the HORIS L12 LPCVD system uses a horizontal quartz tube with zoned heating, the HORIS P12 PECVD system loads graphite boats, and the HORIS TA12 ALD system adds passivation films that reach the wafer edge. Ask each maker how wraparound on the rear side or edge is handled and which cleaning step must follow, because that decides what the next station has to remove.
Ask how target use or carrier life is counted, how long a full maintenance stop takes and which spare parts ship with the tool. Request wafer breakage figures for loading and unloading at full load, and check how breakage, cycle time and throughput compare before contract figures are fixed. Gas, vacuum and exhaust needs are covered in utilities and installation, while trials, FAT and SAT shows where each film result should be signed off. Agree who supplies boats, quartz and targets for the trial so every offer runs with comparable consumables.
Plan the equipment scope
For solar cell deposition and pecvd equipment, begin your enquiry with cell architecture, target layer and substrate or wafer format. Request a configuration-specific quotation and agree on film thickness, uniformity, process sequence and cleaning or maintenance intervals. Each listing shows the published values and the questions to confirm.
NAURA's VORI is a modular vertical inline PVD line for sputtering, with optional multi-arc sources, offered for photovoltaic and other coating work. The page lists 30–1000 mm/min transport, ±5% film uniformity and target utilisation of ≥35% for planar and ≥80% for rotating targets. Quote it against your substrate, layer stack and film targets.
The HORIS L12 is NAURA's horizontal tube LPCVD system for depositing oxide and polysilicon, including phosphorus- and boron-doped polysilicon, on TOPCon, TBC and HTBC cell lines. NAURA lists a 650°C maximum, ±1°C temperature control, wafer breakage of ≤0.01% and a pressure rise of ≤1 Pa/min. Quote it against your own layer, dopant, wafer load and quartz package.
The NAURA HORIS P12 is a tube PECVD system for crystalline-silicon solar cells, listed at 650°C maximum with ±1°C control, ≤0.01% breakage and ≤1 Pa/min pressure rise. It uses graphite boats, multi-point heating and electrodes that can be changed hot. Quote it with your film stack, wafer and boat details.
The NAURA HORIS TA12 is a tube ALD system for surface and edge passivation of TOPCon and TBC solar cells. NAURA lists ≤3% surface uniformity, ≤1 mm edge wrap, single- or double-wafer loading for full and half cells, and a claimed 30% cut in special-gas use. Send your film, wafer and edge targets for a quote.
Ideal Energy offers an R&D PECVD and HJT trial work at its Lingang process laboratory, which runs an HJT experimental line. The company says the R&D chamber matches its production chamber, so a recipe can move straight to volume. Agree the trial protocol first and plan a scale-up check on your production tool.
Ideal Energy's PV sputtering tools use large-span, large-diameter target tubes with a stated use period of more than 30 days, and magnetic rods giving over 1300 gauss at the target surface. Zoned atmosphere control, cold traps and a closed carrier return manage gas and moisture. Send your target materials and film targets to get a configuration.
Ideal Energy's PV PECVD tools deposit cell layers in large multilayer plasma chambers with a dual-vacuum design and rapid transfer under vacuum. RF can be 13.56 MHz or 40.68 MHz, and the plasma is described as stabilising quickly. Quote it with your layer stack, wafer format and film targets, and ask for the full chamber specification.
Dingneng's laboratory PVD magnetron sputtering system coats substrates of 300 × 400 mm, and smaller sizes fit too. The table lists a cycle of no more than 20 minutes for a 100 nm ITO film, with uniformity below 5% within and between substrates. It suits perovskite film development and pilot trials. Quote it with your stack, target material and thickness plan.
S.C New Energy's tube plasma polysilicon deposition furnace grows tunnel oxide, intrinsic polysilicon and doped polysilicon in one process tube. The company points to controlled doping, light wraparound deposition and a non-hot-wall design. Wafer format and output are set when the furnace is configured for your line.
Jinchen's PERTOP is a tube PECVD solution that deposits silicon oxide and in-situ doped amorphous silicon in one combined process, with built-in attention to dust and film uniformity. It is sold as a configured project, so the model number, tube layout and committed throughput come with Jinchen's proposal for your line.
Exact filters only match published specifications. Listings without that published value are not shown.
Selection guide
Deposition equipment must be matched to the intended layer stack and process route. Distinguish a process solution, a furnace family and an exact configured machine. A description of film preparation helps with shortlisting; the cell recipe and electrical result need a trial on your route.
Inputs to prepare before shortlisting
Layer and route
State the target layers and whether steps are performed within one tube or across separate stations. Ask the supplier to map the offered equipment to the intended process sequence.
Substrate and loading
Define wafer or substrate format, loading arrangement and the scope of automated handling. Request configuration-specific capacity with loading and maintenance conditions.
Process services
Identify gases, exhaust, abatement, cleaning and installation responsibilities. Ask for the utility schedule and maintenance procedure for the proposed configuration.
Make quotations comparable
Compare film measurements, uniformity definitions and sample positions on the same process route. Separate nominal batch capacity from a demonstrated process cycle. Ask which process settings, consumables and service tools are part of the offer.
Plan the acceptance test
Define layer measurements, locations and acceptance limits with the process owner. Use representative loaded runs and retain the recipe and instrument records. Record cleaning and maintenance conditions so that a short trial is not mistaken for sustained operation.
Avoid this comparison mistake
A PECVD or polysilicon process description does not by itself prove compatibility with every cell architecture or a resulting cell efficiency.