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EQUIPMENT DIRECTORY

Solar wafer processing equipment — Page 3

Slicing equipment, cutting consumables, cleaning and wafer handling.

Selection considerations

How the wafer stage is split in this directory

Wafer processing runs from the crystal-growth hot zone to a cut wafer ready for the cell line. The listings fall into four groups: growth equipment and its parts, ingot shaping, slicing, and wafer movement. Each group is bought differently, so start your brief by naming which group the purchase belongs to.

Crystal growth and the hot zone

The crystal growth furnace class holds the NAURA SGM-4101. Around it sit crystal growth components such as Huaxin's rigid felt and Hongsheng's ferrofluid vacuum feedthrough, plus graphite purification equipment and crucible coating powder from Corefra. For parts, give the maker your furnace model and drawing; fit and service life depend on the exact hot-zone design.

Squaring, cropping and grinding

Wire saws form the largest group here, led by the TDG NISSIN croppers and squarers, for example the NWSS-210 three-ingot cropper, together with Jingsheng's equipment series. Ingot grinding follows squaring. Compare these machines on the ingot length and diameter you run, the wire type they are set up for, and how the surface is checked after cutting.

Wire, coolant and wafer movement

The saw and the cutting wire should be specified together: DIASC's slicing wire and Tony Electronic's tungsten diamond wire are listed, along with silicon cutting fluids. Ask each supplier which wire and coolant combinations it has run on the quoted machine. After slicing, wafer handling systems such as the Hikrobot transfer equipment move thin wafers between steps; state wafer thickness and carrier type in the enquiry. The breakage and throughput guide helps when suppliers quote breakage rates, and the utilities guide covers water, power and exhaust for saws and furnaces. Wafers then pass to cell production.

Plan the equipment scope

A useful wafer-processing brief names the incoming ingot or wafer, its material and dimensions, and the required downstream condition. Specify whether the scope is a furnace component, a standalone process machine or an integrated handling system. Review the exact model or series description and separate material compatibility from a measured production rate. Ask how samples will be prepared and how cutting, handling or cleaning acceptance will be recorded.

Read equipment buying guides or prepare a sourcing brief.

31 equipment listings

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PAN sandwich rigid felt for thermal-field enquiries

Huaxin's PAN sandwich rigid felt is a carbon-fibre insulation board for furnace hot zones, pictured as rectangular boards. Huaxin names photovoltaic crystal pulling as an application. The entry lists no density, purity, conductivity or temperature figures, so quote from your drawing and ask for the grade sheet. You are buying a component material for your furnace design, made to your dimensions.

Huaxin Thermal-field Materials
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Ferrofluid vacuum sealing transmission devices

Hongsheng builds ferrofluid vacuum sealing transmission devices, the rotary feedthroughs that carry motion through a vacuum wall in PV and semiconductor equipment such as crystal-growth furnaces. The catalogue shows several configurations under one family name, without a shared model number or spec sheet. To buy one, send your shaft and flange drawings with pressure, speed and load, and Hongsheng proposes a model with its own drawing, operating limits and leak-test result. A complete furnace is quoted separately.

Hangzhou Hongsheng Intelligent Technology Co., Ltd.
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Photovoltaic ingot transfer robot series

This CMR variant serves the PV slicing hall. It moves ingots and loads or unloads the slicing machine with a dedicated gripping arm. Two storage positions let one trip deliver a loaded carrier and collect the empty one. Agree the payload, the interface dimensions and the floor conditions for your configuration before ordering.

Hangzhou Hikrobot Co., Ltd.
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