PV MANUFACTURING EQUIPMENT
Slicing equipment, cutting consumables, cleaning and wafer handling.
Wafer processing runs from the crystal-growth hot zone to a cut wafer ready for the cell line. The listings fall into four groups: growth equipment and its parts, ingot shaping, slicing, and wafer movement. Each group is bought differently, so start your brief by naming which group the purchase belongs to.
The crystal growth furnace class holds the NAURA SGM-4101. Around it sit crystal growth components such as Huaxin's rigid felt and Hongsheng's ferrofluid vacuum feedthrough, plus graphite purification equipment and crucible coating powder from Corefra. For parts, give the maker your furnace model and drawing; fit and service life depend on the exact hot-zone design.
Wire saws form the largest group here, led by the TDG NISSIN croppers and squarers, for example the NWSS-210 three-ingot cropper, together with Jingsheng's equipment series. Ingot grinding follows squaring. Compare these machines on the ingot length and diameter you run, the wire type they are set up for, and how the surface is checked after cutting.
The saw and the cutting wire should be specified together: DIASC's slicing wire and Tony Electronic's tungsten diamond wire are listed, along with silicon cutting fluids. Ask each supplier which wire and coolant combinations it has run on the quoted machine. After slicing, wafer handling systems such as the Hikrobot transfer equipment move thin wafers between steps; state wafer thickness and carrier type in the enquiry. The breakage and throughput guide helps when suppliers quote breakage rates, and the utilities guide covers water, power and exhaust for saws and furnaces. Wafers then pass to cell production.
A useful wafer-processing brief names the incoming ingot or wafer, its material and dimensions, and the required downstream condition. Specify whether the scope is a furnace component, a standalone process machine or an integrated handling system. Review the exact model or series description and separate material compatibility from a measured production rate. Ask how samples will be prepared and how cutting, handling or cleaning acceptance will be recorded.
DIASC water-soluble synthetic coolant for diamond-wire cutting of silicon wafers, polysilicon and other hard, brittle materials. Sanchao gives a one-to-twenty mix with water, a pH band of 8.0–9.2, surface tension of 30 dyn/cm or less, a two-year shelf life and 25 kg or 200 kg packs. Request the SDS and technical sheet for your grade with the quote.
DIASC / SanchaoDIASC diamond wheels for face grinding solar silicon blocks. Sanchao offers resin-bond and metal-bond versions and uses different specifications for rough and finish grinding. The page lists no diameter, grit, concentration or speed rating, so each wheel is defined on a drawing matched to your grinder and block.
DIASC / SanchaoHeavier DIASC electroplated diamond wire for cropping and squaring silicon ingots before wafering. Six sizes run from 290 μm finished on a 220 μm core to 460 μm on a 350 μm core, with 30–40 to 45–55 μm grain and a 30 km maximum length. Send your ingot cut map so Sanchao can quote the right row.
DIASC / SanchaoDIASC electroplated diamond wire for slicing crystalline-silicon wafers. Tungsten-core grades run 41–47 μm finished on 29–35 μm cores; carbon-steel grades run 47–59 μm on 35–45 μm cores. All carry 6–12 μm grain in lengths up to 240 km. Sanchao's 2025 report says PV fine-wire output was cut back, so ask which diameters it can ship before planning a trial.
DIASC / SanchaoNAURA's VERAL GH is a CVD furnace that lays a semiconductor-grade silicon-carbide coating on graphite parts and SiC substrates. The product page lists a 1600°C maximum temperature, ±10°C uniformity and a 10 Pa cold ultimate vacuum, with liquid and solid feed arrangements. It suits buyers of coated graphite components; send part drawings and coating targets to get a quote.
NAURAThe CONAL VH is a continuous high-temperature furnace from NAURA for purifying graphite structural parts and graphite felt used inside semiconductor and solar equipment. Its working zone is 600 × 600 × 600 mm. The page gives two maximum temperatures, 2400°C in the text and 1900°C in the table, so ask NAURA which one applies to the furnace you are quoted.
NAURAThe NAURA SGM 4101 is a Czochralski furnace for pulling photovoltaic monocrystalline silicon. NAURA lists 10–16 inch ingots, P- and N-type growth, a 1500–1600°C working range, ≤2 Pa vacuum and a 36–42 inch hot zone, with a magnetic-field option. Quote it with your ingot size, feedstock and crystal-quality targets.
NAURAThe TDG NISSIN NWSS-840 crops long monocrystalline ingots into six segments with seven cuts, and can also take head, tail and sample slices. It accepts ingots 1800–4000 mm long and sets cut lengths from 300 to 700 mm, with automatic centring and length changes that leave the wire intact. The sheet lists 8 or 9 inch diameters, while one catalogue summary says 8–12 inch.
TDG NISSINThe TDG NISSIN NWSS-812 crops one end, head or tail, of twelve polycrystalline blocks per cut. It takes 156 × 156 mm blocks 200 to 400 mm long and runs thicker 0.37–0.42 mm coated wire at up to 1200 m/min from a 7 km spool. Two rotating tables let operators load one side while the other cuts. Plan a second pass if you need both ends cropped.
TDG NISSINThe TDG NISSIN NWSS-360 is a diamond multiwire cropper for large polysilicon batches. Its page text names two loads: 36 blocks 400 mm long or 48 blocks 300 mm long. The data sheet covers the 36-block load at 156 × 156 × 400 mm, with 40 kW power and 320 L/min cooling water. For the 48-block load, request a fixture and figures of its own.
TDG NISSINTDG NISSIN's NWSS-250 and NWSS-250A are diamond-wire croppers that take the head and tail off 25 polycrystalline blocks in one load. One data sheet lists both: 156 × 156 × 300 mm stock, 0.31–0.33 mm coated wire, 900 m/min. The 250A has a shorter 350 mm lift, draws 35 kW against 27 kW and needs more floor space. The product page text says 400 mm blocks, so settle block length when you ask for a quote.
TDG NISSINThe NWSS-125G is the smaller G5 diamond-wire squarer in the TDG NISSIN range. It squares 25 mono ingots of 6 or 6.5 inch or 16 of 8 or 8.5 inch, or cuts an 840 × 840 × 500 mm poly block into 25 columns. Wire speed reaches 720 m/min, power is 85 kW and the frame is 3550 mm long.
TDG NISSINExact filters only match published specifications. Listings without that published value are not shown.