PV MANUFACTURING EQUIPMENT
Find machinery by production stage and the requirements of your line.
The name covers more than wafer slicing. An ingot from a crystal growth furnace is first cropped to remove head and tail, then squared into a bar, often finished on ingot grinding equipment, and only then sliced. Cut wafers go on to cleaning and wafer handling, all within wafer processing. Every step consumes cutting wire, such as DIASC's cropping and squaring diamond wire and slicing diamond wire, plus coolant from silicon cutting fluids.
Crystal wafer slicing equipment from Zhejiang Jingsheng Mechanical & Electrical handles PV silicon, semiconductor silicon and sapphire, each machine set up for its own material and size window. Start from your ingot and the wafer quality your cell line needs.
The remaining machines come from TDG NISSIN. For cropping, the NWSS-DH02 uses one wire for low volumes and sample slices, the NWSS-840 makes seven cuts for six segments with adjustable length, and the NWSS-210 crops three long ingots side by side. For squaring, the NWSS-DD700Z takes one segment per cut, the NWSS-DS700Z runs two stations, and the NWSS-JK4700 combines cropping and squaring on one frame.
Double-end croppers range from the NWSS-6S at six blocks to the NWSS-7S at seven. The NWSS-812 cuts one end of twelve blocks, the NWSS-250 and 250A family takes 25 blocks and the NWSS-360 takes 36 or 48. Batch squarers come at G6 with slurry wire in the NWSS-125M(K) or diamond wire in the NWSS-125H, and at G5 in the NWSS-125G.
Sort first by stock form, round mono ingot or cast poly block, then by batch size, then by wire type. Compare total material loss and accepted batch time with the fixture and wire recipe held fixed, counting loading, table rotation and offcut removal. To put batch claims on one basis, use the guide to breakage, cycle time and throughput claims, and utilities and installation requirements covers cooling, power and floor loading. Get the chosen configuration and trial results written into the offer from TDG NISSIN or Jingsheng, and run acceptance as the FAT and SAT guide sets out.
For pv wafer slicing equipment, begin your enquiry with ingot material and dimensions, target wafer thickness and cutting method. Request a configuration-specific quotation and agree on wire specification, kerf measurement, breakage criteria and downstream cleaning. Each listing shows the published values and the questions to confirm.
The TDG NISSIN NWSS-DS700Z squares two monocrystalline ingot segments per cut with diamond wire. It takes 200–250 mm diameter segments 150–900 mm long, centres them with mechanical grippers, finds the crystal edge with a measuring instrument and removes side pieces automatically. Power is 37 kW. Your drawing sets the final square size and tolerance.
TDG NISSINThe TDG NISSIN NWSS-7S is a diamond multiwire cropper that cuts heads and tails off seven 156 × 156 mm polycrystalline blocks in one pass, taking 270–450 mm incoming lengths down to 230–400 mm. It draws 39 kW at 380 V and weighs 11000 kg. Its English sheet heading says single end, so have the quotation state double-end cutting.
TDG NISSINJingsheng's crystal slicing machines cut photovoltaic silicon, semiconductor silicon and sapphire, with a published range of four to twelve inches. Each configuration is set up for particular materials and sizes. Send your ingot geometry, wafer thickness and loading route, and ask Jingsheng to name the model, wire setup and automation it proposes.
Zhejiang Jingsheng Mechanical & Electrical Co., Ltd.Exact filters only match published specifications. Listings without that published value are not shown.
A wafer-slicing purchase links the incoming workpiece to the required wafer and the subsequent cleaning process. The useful comparison is not simply machine speed: it includes material, ingot geometry, wire arrangement, recoverable wafer output and the conditions under which quality is measured.
Request a capacity calculation tied to the proposed workpiece and cutting recipe. Compare saleable output, wire consumption and the agreed breakage definition on identical samples. Separate cutting time from loading, changeover and planned maintenance.
Agree a representative cutting run and a sampling plan for thickness, surface condition and breakage. Record the wire configuration, workpiece batch and measurement procedure. Establish which consumables and sample preparation steps are included in the trial.
Inch ranges in a catalogue identify a processing family. Ask which combinations are offered and what rate applies to your ingot.
Procurement guidance by PVYard Editorial, updated 2026-10-07. Turn the requirements into a sourcing brief →