PV MANUFACTURING EQUIPMENT
Slicing equipment, cutting consumables, cleaning and wafer handling.
Wafer processing runs from the crystal-growth hot zone to a cut wafer ready for the cell line. The listings fall into four groups: growth equipment and its parts, ingot shaping, slicing, and wafer movement. Each group is bought differently, so start your brief by naming which group the purchase belongs to.
The crystal growth furnace class holds the NAURA SGM-4101. Around it sit crystal growth components such as Huaxin's rigid felt and Hongsheng's ferrofluid vacuum feedthrough, plus graphite purification equipment and crucible coating powder from Corefra. For parts, give the maker your furnace model and drawing; fit and service life depend on the exact hot-zone design.
Wire saws form the largest group here, led by the TDG NISSIN croppers and squarers, for example the NWSS-210 three-ingot cropper, together with Jingsheng's equipment series. Ingot grinding follows squaring. Compare these machines on the ingot length and diameter you run, the wire type they are set up for, and how the surface is checked after cutting.
The saw and the cutting wire should be specified together: DIASC's slicing wire and Tony Electronic's tungsten diamond wire are listed, along with silicon cutting fluids. Ask each supplier which wire and coolant combinations it has run on the quoted machine. After slicing, wafer handling systems such as the Hikrobot transfer equipment move thin wafers between steps; state wafer thickness and carrier type in the enquiry. The breakage and throughput guide helps when suppliers quote breakage rates, and the utilities guide covers water, power and exhaust for saws and furnaces. Wafers then pass to cell production.
A useful wafer-processing brief names the incoming ingot or wafer, its material and dimensions, and the required downstream condition. Specify whether the scope is a furnace component, a standalone process machine or an integrated handling system. Review the exact model or series description and separate material compatibility from a measured production rate. Ask how samples will be prepared and how cutting, handling or cleaning acceptance will be recorded.
NWSS-125H is the TDG NISSIN G6 squarer for fixed-abrasive diamond wire. Its mono fixtures carry 36 ingots at 6 or 6.5 inch, or 25 at 8 or 8.5 inch, or cuts a 1000 × 1000 × 500 mm poly block into 36 columns of 156 × 156 × 500 mm. Coated wire of 0.31–0.33 mm runs at up to 900 m/min, and the machine is rated 90 kW.
TDG NISSINThe NVG-7500 is a TDG NISSIN vertical centre that grinds the flat faces and rounds or chamfers the corners of mono ingots and poly blocks after squaring. It takes 156–160 mm sides or 8–10 inch diameters, spins wheels up to 3000 rpm and draws 45 kW. Ask which model revision and length limit the quotation covers.
TDG NISSINTDG NISSIN's NWSS-125M(K) squares a G6 load with slurry-assisted multiwire cutting. One fixture takes 36 mono ingots of 6 or 6.5 inch, another takes 25 of 8 or 8.5 inch, and a poly setup turns a 1000 × 1000 × 450 mm block into 36 pieces measuring 156 × 156 × 450 mm. Listed machine power is 100 kW.
TDG NISSINThe NWSS-JK4700 crops and squares monocrystalline silicon on one machine, and TDG NISSIN says both jobs can run at the same time. It takes one 4 m ingot of 8–9 inch diameter and works segments 150–700 mm long. It suits plants that want to merge two ingot steps into one footprint. Ask for a timing chart and material-route drawing with the quote.
TDG NISSINThe NWSS-DD700Z squares one monocrystalline ingot segment at a time with diamond wire. TDG NISSIN lists 150–700 mm segments in 200–250 mm diameter. Loading and unloading grippers come with the machine; edge detection and automatic centring are options. It suits smaller squaring cells. Specify your square drawing and which options you want when asking for a price.
TDG NISSINThe NWSS-210 crops three monocrystalline ingots at the same time using diamond multiwire across six cutting heads. TDG NISSIN lists 2.2 m ingots in 6, 6.5, 8 or 8.5 inch diameters and a thin 0.31–0.33 mm coated wire. It fits plants that cut full-length ingots into segments in one pass. Send your cut map for each ingot when you ask for a quote, and check the 400 L/min cooling demand.
TDG NISSINThe NWSS-6S is TDG NISSIN's six-block cropper for polycrystalline silicon. It trims the head and tail of six 156 × 156 mm blocks with diamond multiwire, taking 220–400 mm incoming blocks down to 160–330 mm. Two rotating tables let the next batch be loaded while the current one cuts. It suits plants running shorter blocks than the seven-block NWSS-7S handles. Quote it with your block drawing and the finished length you need.
TDG NISSINThe TDG NISSIN NWSS-DH02 is a compact single-wire diamond machine for cropping monocrystalline ingots and cutting sample slices, with finished lengths of 100–700 mm, 12 kW power and a 2000 kg frame. Its text gives 8–12 inch stock over four metres long, while its table gives one 6–8.5 inch, four-metre ingot, so settle the size range first.
TDG NISSINThe TDG NISSIN NWSS-DS700Z squares two monocrystalline ingot segments per cut with diamond wire. It takes 200–250 mm diameter segments 150–900 mm long, centres them with mechanical grippers, finds the crystal edge with a measuring instrument and removes side pieces automatically. Power is 37 kW. Your drawing sets the final square size and tolerance.
TDG NISSINThe TDG NISSIN NWSS-7S is a diamond multiwire cropper that cuts heads and tails off seven 156 × 156 mm polycrystalline blocks in one pass, taking 270–450 mm incoming lengths down to 230–400 mm. It draws 39 kW at 380 V and weighs 11000 kg. Its English sheet heading says single end, so have the quotation state double-end cutting.
TDG NISSINCF-SN is Corefra's silicon nitride powder for the release coating sprayed inside quartz crucibles in multicrystalline silicon ingot casting. The sheet gives N >39%, O ≤1.0%, C ≤0.2%, Fe, Al, Ca, Mn and Cu at ≤5 ppm each and a D50 of 2 µm, each with a GB/T method. Slurry formula, coating thickness, phase content and furnace cycle come from Corefra's guidance and your own trial.
Hebei Corefra Silicon Nitride MaterialTony's diamond cutting wire carries 5–8 μm diamond particles on a carbon-steel core of 36–42 μm or a tungsten core of 24–28 μm. It runs on a slicing machine to cut mono- and multicrystalline silicon wafers. Order it as coated finished wire, name the exact core size, and ask for spool, length and lot documents to come with the sample.
Zhejiang Tony Electronic Co., Ltd.Exact filters only match published specifications. Listings without that published value are not shown.